Cutting-Edge Nano-Copper TechnologyEmpowering global manufacturing
Proprietary core technology for antioxidant and anti-agglomeration performance, dedicated to developing functional antimicrobial and antiviral nanomaterials.
Delivering customized, high-performance nanomaterial solutions for global industries including healthcare, construction, mechanical manufacturing, and electronics & chemicals.
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Patent Awards and Technical Barriers
Deeply rooted in nanomaterials with core proprietary IP, establishing a leading technological advantage in the industry.
National Invention Patent Granted
A method for preparing copper nanoparticles using a special process to construct nanoscale microreactors.
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Certified by a national-level testing agency; data is authentic and reliable.
View Test ReportWide Range of Applications
Nanocopper materials, with their superior performance, demonstrate significant application potential across multiple industries.
Healthcare
Antibacterial rate ≥ 99.9% (E. coli/S. aureus), mold resistance for 24 hours at level 0, non-irritating and non-sensitizing, copper ion leaching only 1/25 of the national standard. After UV aging equivalent to 5 years, antibacterial rate remains ≥ 97%. Ideal for medical textiles, dressings, protective clothing, and medical device surface coatings—long-lasting and safe.
Photovoltaic sector
The only globally scalable solution for producing oxidation-resistant, easily dispersible nano-copper powder. At high temperatures (> 150°C), its electrical conductivity is only 1/5 that of silver, yet it offers far superior stability compared to nano-silver. It can replace silver paste to reduce costs by 30%–50%, aligns with HJT cell processes, and drives the industry shift from silver to copper.
New Energy / Solar Cells
Coefficient of thermal expansion (CTE) mismatch with semiconductor materials is less than 10%, reducing thermal stress cracking risk in power module packaging by 40%. Withstands 250°C for 5 minutes without oxidation, compatible with high-temperature sintering processes. Resists oxidation during atmospheric storage for 60 days, lowering storage and shipping costs. Provides a high-reliability copper-based solution for battery interconnects and conductive pastes.
Mechanical Engineering
Uniform nanoparticle size with no agglomeration; disperses easily in base oils or coatings. Withstands oxidation at high temperatures up to 250°C. Ideal for extreme pressure anti-wear lubricant additives, self-lubricating composites, and high-thermal-conductivity coatings. Eliminates coating/uncoating steps—add directly to simplify processes and reduce overall manufacturing costs.
Chemical Industry
High specific surface area, uniform particle size, excellent crystallinity, and tightly ordered surface atomic arrangement. Eco-friendly, pollution-free production with high batch consistency. Ideal for use as a high-efficiency catalyst, antimicrobial masterbatch, and anti-fouling coating additive. Offers long-lasting dispersion and compatibility with multiple resin systems (TPU, PET, ABS, PP).
Military Applications
Stable performance in extreme high and low temperatures (non-oxidizing at 250°C; atmospheric storage for 60 days), providing high-reliability electromagnetic shielding, radar-absorbing, anti-corrosion, and antimicrobial coatings, as well as lightweight conductive composites for military equipment. Meets the stringent requirements of military operations for material stability and secure supply chains.